Products

Electronic Tools
Semiconductor Industry
SiC Processing

SiC Processing ID Wheel (Cutting)

  • null
    Product Features
  • – High material removal rate for reduced cycle times
  • – Excellent grindability for low grinding load
  • – Minimized mechanical/thermal damage from grinding
  • – Low grinding load and superior surface finish
CONTACT US

SiC Processing ID Wheel (Cutting)(1)